Production Cycle/Lead Time
12 hours* ~ 3 weeks

PCB Construction Technology
Single & Double-Sided
Multi-Layer (2-14+)
Blind Via
Buried Via

Substrate Materials
FR4 (04,06,08*)
Roger4003
 Polyimide 
Teflon 
CEM1 
CEM2
 N9320-13RF (Neltec)

Copper "Weight"
0.50, 1, 2, and 3 oz (base)

Mechanical Drilling Capabilities
Smallest drill diameter .010"
(.005~.006" finished after plating)

Imaging Resolution
<.004" traces
<.004" space ("gap")

Soldermask (resist)
All boards SMOBC
LPI (Green, Red, Blue and Clear)
Wet (Green and Black)

Final Metalic Finishes

NEW! Immersion Silver
NEW! LEAD-FREE HASL
HASL (Hot Air Solder Level)
White Tin
 "Hard" Gold (Electrolytic) 
ENIG (Electroless Nickel/Immersion Gold)
 Soft Bondable Gold
Conductive Carbon Ink
Gold edge connectors ("Fingers")

Machining
CNC Scoring w/ "jump line" capabilities (+/-.005" tol.)
 
CNC Routing: Min. kerf=.031";
min. internal radius=.015"
 
Counter Sink / Counter Bore 
Card Edge Beveling

Electrical Testing
NET-list
Comparison ("Golden Board")
Flying Probe