Excel in Capabilities
Excel
Electrocircuit's Engineering team is always accepting new challenges for product development.
Excel provides incomparable support, research & development for new,
cutting-edge product development and high-yield, cost-effective
production processes.
Contact Excel Engineering 248.373.0700
Eng@Excelelectro.com
Design For Manufacturing checks at Pre-Production Engineering 
Excel Electrocircuit, Inc. uses Frontline Genesis (previously known
as "Valor") exclusively for all CAM data.
First implemented in-house in 1998, this
highly automated platform is interlinked with the custom
built Production Control System, quoted specifications,
customer-specific criteria database, and manufacturing processes.
Any discrepancies between quoted values, IPC-600-A
guidelines, customer-specific requirements, or in-house
manufacturing capabilities are identified during the
Design Analysis DFM phase.
This facilitates rapid resolve of any issues that would impact functionality of
your product, and assures the product you receive from Excel
Electrocircuit functions per your design.
Map & Contact info
|
|
|
| As a World
Class
Manufacturer of Printed Circuit Boards,
Excel
Electrocircuit, Inc. offers the most competitive
pricing
for both common build technology and cutting edge prototypes requiring
experimental construction. |
| Manufacturing Capabilities and Optimal Design Criteria |
| Manufacturing
Capabilities |
Common / Satandard |
Advanced / Premium / Special |
| Production
Cycle/Lead Time |
3 weeks standard |
12 hours (same-day turn), 1 day, 3 day, 5 day, 7 days, and 2 weeks ** |
|
PCB Construction Technology |
Single
sided, Double-Sided, Multi-Layer |
Up
to 24 layer, Blind Via
Buried Via, sequencial build |
| Panel Size |
18 x 24" |
24 x 76"> * |
| Panel Thickness |
.031 - .062" |
.005" - .030, .063 - .400" * |
|
Substrate Materials |
FR4, FR406, FR408, GR, GY, GP, GX, GT, GI glass-filled woven, CEM1, CEM3 |
Specialty/High Frequency, Roger4003, Polyimide, ceramic filled Teflon, Duroid, N9320-13RF
(Neltec), Metal-backed Aluminum, Brass |
| Copper Weight
(base, ounce/sq.in.) |
0.50,
1, 2, and 3 oz. |
4
oz. base; 5.0+ ounce/sq.in. finished * |
| Drilled Hole Size (min.) |
.010"
drill (.005~.006" finished plated) |
< .010" * |
| Mechanical Tolerance |
+/-.010" positional |
+/-.005" positional |
| Feature Resolution |
.006"
traces , .006" space ("gap") |
<.004"
traces , <.004" space ("gap") |
| Imagable panel area |
17 x 23" |
>17.5 x 23.5" * |
| Front-to-Back Registration |
+/-.003" |
+/-.0015" |
| Soldermask
(resist) |
All
boards SMOBC
LPI (Green, Red, Blue and Clear) |
LPI (any color), Wet (Green. Black, other); Peelable / strippable solder mask; Plugged/capped via; |
| Soldermask to land clearance |
.004" (LPI) ; .008" (screenable wet epoxy) |
<.004" (LPI) ; <.008" (screenable wet epoxy) * |
| Soldermask dam (LPI) |
.008" |
.004" (LPI) * |
| Etched feature : artwork deviation |
+/-.0007" (1/2 oz. copper) ; .002" (1.0 oz. copper) |
Please call for specifications on copper weights over 1.0 ounce/sq.in. * |
| Plated-thru hole aspect ratio |
5:1 |
12:1 * |
| Copper Plating Thickness |
.001" nominal |
> .001" * |
| Final
Metalic Finishes |
Tin-Lead HASL (Hot Air Solder Level),
LEAD-FREE HASL,
White
Tin |
Immersion
Silver
Electrolytic NI
Conductive Carbon ink
"Hard" Gold (Electrolytic)
ENIG (Electroless Nickel/Immersion Gold)
Soft Bondable Gold
Conductive Carbon Ink
Gold edge connectors ("Fingers") |
|
Tin/Lead Solder Composition |
63% Tin / 37% Lead eutectic |
|
| Lead Free |
SN100 |
|
|
Tensile strength, plated copper |
45K PSI |
|
| Elongation, plated copper |
> 20%, typical 24% |
|
|
Immersion Tin |
Hot Tin, 20 - 70u |
|
|
Nickel plating, Electrolytic |
QQ-N-290 |
|
|
Gold plating, Immersion |
3 - 12u |
|
|
Gold plating, Electrolytic |
MIL-G-45204, Type III, Grade A |
|
|
Bright Tin Plating |
MIL-T-10727C, Type I (ED) |
|
|
Electroless Nickel |
MIL-C-26074E |
|
|
Electroless Nickel / Immersion Gold |
MacDermid Planar |
|
|
Multlayer Press Method |
Hi-Temp vacuum assisted hydraulic press |
|
|
Multlayer Press Layer Registration |
+/-.003" |
<+/-.003" * |
|
Multlayer Press Finished Thickness |
+/-8% |
<+/-8% * |
|
Multilayer Bonding Media |
Woven Glass Reinforced Thermosets, Thermoplastics |
|
| Machining
/ profiling |
CNC
Scoring: (+/-.010" tol.)
CNC Routing: (+/-.010" tol.)
Standard kerf=.094";
Standard internal radius=.047"
|
CNC
Scoring w/ jump capabilities (+/-.005" tol.);
CNC Routing +/-.005" tol.,
Min. kerf .031"; min. int. radius .015"; Counter Sink;
Counter Bore; Card Edge Beveling
|
| Electrical
Testing |
NET-list based,
Comparison ("Golden Board"), Flying Probe, Moving Grid |
Rigid fixture |
|
|
|
|
|
* Please call for evaluation by Engineering 248.373.0700 ask for Janak |
|
|
** Lead time is for production only and does not include transit time for shipping. |
Questions? Our staff is always ready to help!
Customer Service: 248.373.0700 ext. 28
Engineering: 248.373.0700ext. 22 |
|
|
